The insulating thermal dielectric used in Insulated Metal Substrate PCB is a special material, with excellent thermal conductivity, normally 8 to 10 times more thermally conductive than FR4.
The dielectric is usually made with filling material containing aluminum oxide, aluminum nitride, boron nitride, magnesium oxide or silicon oxide.
An aluminum metal base is perhaps the most common metallic base. It is suitable for drilling, punching, cutting and even bending into 3D shapes. Copper is used in cases of very high thermal conductivity needs.
IMS boards reduce the need for heat sinks in electronics like LED lighting, power supplies, amplifiers etc.
Ceramic circuit boards:
Ceramic circuit boards bear the highest temperature resistance and highest electrical insulation performance, with the advantages of low dielectric constant and dielectric loss, high thermal conductivity, good chemical stability and similar thermal expansion coefficient as the components.
PCB based on electronic ceramics material can be made into various shapes.
Copper Substrate PCB
1 Layer
Finishing : OSP
Aluminum Substrate PCB
1 Layer
Finishing : ENIG
Lead time
Our standard lead time for IMS PCB is 2 to 3 weeks. Quick turn around is available on request.
Flexibility
We accept small and medium orders.
Material
The materials of IMS PCB, such as the aluminum substrate (1 to 8W/mk), copper substrate (2 to 8W/mk) as well as ceramic substrate (up to 170W/mk).